FPC / Ridid-Flex (awọn agbara)
Kosemi PCB (awọn agbara)
FPC / Rigid-Flex (awọn agbara)
| Kika Layer | 1-28 fẹlẹfẹlẹ |  |
| Iru Laminates | FR-4 (Tg giga, Halogen ọfẹ, igbohunsafẹfẹ giga) PTFE, BT, Getek, ipilẹ aluminiomu base ipilẹ Ejò ， KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon |
|
| Sisanra Board | 6-240mili | |
| Iwọn Max Ejò | 210um (6oz) fun fẹlẹfẹlẹ ti inu 210um (6oz) fun Layer ti ita | |
| Min darí lu iwọn | 0.2mm (0.008 ″) | |
| Ipin ratio | 12: 1 | |
| Max nronu iwọn | Ẹgbẹ apa tabi awọn ẹgbẹ meji: 500mm * 1200mm, | |
| Awọn fẹlẹfẹlẹ pupọ: 508mm X 610mm (20 ″ X 24 ″) | ||
| Iwọn ila ila / aaye | 0.076mm / 0.076mm (0.003 ″ / 0.003 ″) / 3mil / 3mil | |
| Nipasẹ iru iho | Afọju / sin / So pọ (VOP, VIP…) | |
| HDI / Microvia | BẸẸNI | |
| Ipari dada | HASL | |
| Asiwaju HASL | ||
| Gull Immersion (ENIG), Tin immersion, Fadaka Ririnkiri | ||
| Aṣoju Solderability Organic (OSP) / ENTEK | ||
| Flash Gold (Ṣiṣẹ Gold lile) | ||
| ENEPIG | ||
| Aṣayan Gold Gold, sisanra Gold to 3um (120u ”) | ||
| Ika Goolu, Tẹjade Erogba, Peelable S / M | ||
| Awọ boju Solder | Green, Blue, White, Black, Clear, abbl. | |
| Ikọjujasi | Ami ọkan, iyatọ, imukuro coplanar controlled 10% | |
| Ìla pari iru | Iṣiro CNC; V-Ifimaaki / Ge; Punch | |
| Awọn ifarada | Min ifarada Iho (NPTH) ± 0.05mm | |
| Min Ifarada Iho (PTH) ± 0.075mm | ||
| Min Ifarada Aṣayan ± 0.05mm |
Kosemi PCB (awọn agbara)
| Too | Ohun kan | Agbara |  |
|
| Kika Layer | Kosemi-rọ PCB | 2 ～ 14 | ||
| Flex PCB | 1 ～ 10 | |||
| Igbimọ | Min. Sisanra | 0,08 +/- 0,03mm | ||
| Max. Sisanra | 6mm | |||
| Max. Iwọn | 485mm * 1000mm | |||
| Iho & Iho | Min.Hole | 0.15mm | ||
| Iho Min.Slot | 0.6mm | |||
| Ipin ratio | 10: 1 | |||
| Wa kakiri | Min.Width / Aaye | 0.05 / 0.05mm | ||
| Ifarada | Wa kakiri W / S | ± 0.03mm | ||
| (W / S≥0.3mm: ± 10%) | ||||
| Iho si iho | ± 0.075mm | |||
| Iho Dimension | ± 0.075mm | |||
| Ikọjujasi | 0 ≤ Iye ≤ 50Ω: ± 5Ω 50Ω ≤ Iye: ± 10% Ω | |||
| Ohun elo | Sisọki Basefilm | PI: 3mil 2mil 1mil 0.8mil 0.5mil | ||
| ED &RA Cu: 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ | ||||
| Basefilm Olupese akọkọ | Shengyi / Taiflex / Dupont / Doosan / Thinflex | |||
| Apejuwe Coverlay | PI: 2mil 1mil 0.5mil | |||
| Awọ LPI | Alawọ ewe / Yellow / Funfun / Dudu / Bulu / Pupa | |||
| PI Stiffener | T: 25um ～ 250um | |||
| FR4 Stiffener | T: 100um ～ 2000um | |||
| SUS Stiffener | T: 100um ～ 400um | |||
| AL Stiffener | T: 100um ～ 1600um | |||
| Teepu | 3M / Tesa / Nitto | |||
| Idaabobo EMI | Aworan fadaka / Ejò / inki Fadaka | |||
| Ipari dada | OSP | 0.1 - 0.3um | ||
| HASL | Sn: 5um - 40um | |||
| HASL (Leed ọfẹ) | Sn: 5um - 40um | |||
| ENEPIG | Ni: 1.0 - 6.0um | |||
| Ba: 0.015-0.10um | ||||
| Au: 0.015 - 0.10um | ||||
| Gbigbe wura lile | Ni: 1.0 - 6.0um | |||
| Au: 0.02um - 1um | ||||
| Flash wura | Ni: 1.0 - 6.0um | |||
| Au: 0.02um - 0.1um | ||||
| ENIG | Ni: 1.0 - 6.0um | |||
| Au: 0.015um - 0.10um | ||||
| Fadaka Immesion | Ag: 0.1 - 0.3um | |||
| Gbingbin Tin | Sn: 5um - 35um | |||